Paras Semiconductors Partners with US-Based BroadPak to Build Advanced Packaging Facility in India

Paras Semiconductors, a subsidiary of Paras Defence and Space Technologies, has announced a strategic technology partnership with US-based BroadPak Corporation. The tie-up is aimed at developing advanced semiconductor packaging capabilities within India through the establishment of a specialized outsourced semiconductor assembly and test (OSAT) facility.

According to the company release, the proposed unit will concentrate on advanced heterogeneous integration and 3D packaging technologies. Specific operational focus areas will include 2.5D and 3D packaging, chiplet integration, hybrid bonding, wafer-level and panel-level fan-out packaging, co-packaged optics, alongside testing and qualification services.

Through this partnership, Paras Semiconductors will gain direct access to BroadPak's intellectual property covering design, manufacturing, and system integration. Additionally, the agreement includes technology transfer and process know-how. Both firms also plan to explore the joint development of packaging platforms specifically tailored for artificial intelligence and high-performance computing applications, alongside collaborative training programs for Indian engineers.

Headquartered in San Jose, California, BroadPak was founded in 2007 and brings specialized expertise in advanced packaging design, manufacturing, and system integration.

Munjal Sharad Shah, Managing Director of Paras Defence and Space Technologies, stated that the entry into the semiconductor sector represents a strategic expansion into a technology domain that is increasingly critical for India's artificial intelligence, data centers, and industrial capabilities.

Santosh Kumar, CEO of Paras Semiconductors, added that the company intends to build a packaging platform capable of addressing the performance, connectivity, and thermal requirements of next-generation technological applications.

Farhang Yazdani, Founder and CEO of BroadPak, noted that India's growing semiconductor ecosystem provides an important opportunity to develop domestic capabilities in heterogeneous integration and system-level packaging.

The proposed facility is designed to address high-volume manufacturing requirements and strategic electronics needs, including specialized devices for optical and optronic systems, networking infrastructure, high-performance computing, and data centers.

"This partnership marks a significant step for domestic manufacturing as India builds its semiconductor ecosystem. By acquiring technology transfer and process know-how for advanced heterogeneous integration and 3D packaging from BroadPak, Paras Semiconductors is positioning itself to cater directly to high-demand sectors like artificial intelligence and high-performance computing. Access to specialized intellectual property will be vital in meeting stringent global standards for high-volume manufacturing and data center infrastructure." — Dr. Shishir Gupta, Founder & CEO, StartupLanes