izmo Microsystems Develops 40 GHz RF Semiconductor Package for Defence Applications

Bengaluru-based izmo Microsystems Pvt. Ltd., a subsidiary of IZMO Limited, announced the development of an indigenous high-frequency RF Quad Flat No-Lead (QFN) package designed for semiconductor devices operating at frequencies up to 40 GHz. The company enters the defence electronics value chain as domestic procurement mandates and budgetary allocations reshape the sector.

The package was designed, developed, and manufactured entirely in India for a customer developing high-frequency RF modules for defence and secure wireless communication applications. Following successful assembly and electrical validation, izmo Microsystems has started production shipments and established manufacturing processes to support scaling.

At higher microwave frequencies, conventional molded and open cavity QFN packages often face performance limitations due to package parasitics. To address this, izmo Microsystems engineered a proprietary package architecture featuring optimized trace geometry, die positioning, and wire bond lengths of approximately 0.3 mm, paired with a precision air cavity surrounding the die. This configuration minimizes parasitic effects to ensure reliable operation at up to 40 GHz.

The newly developed capability has applications across radar, electronic warfare, secure communications, aerospace, satellite communications, and advanced wireless systems. The technology contributes to greater domestic supply chain resilience for strategic applications amid growing demand for local electronic and semiconductor capabilities.

The timing of the development aligns with national policy initiatives, including the Government of India's Semicon 2.0 program, which carries an outlay of ₹1,27,500 crore. The program focuses on strengthening the ATMP and OSAT industry by bringing advanced semiconductor packaging technologies to India.

Dinanath Soni, Director of izmo Microsystems, noted that high-frequency RF devices place strict demands on packaging, requiring the package to function as an integral part of the system at 40 GHz. He stated that the company has taken the product from design through fabrication, assembly, and validation into production shipments, positioning itself to support future scale in strategic electronics.

izmo Microsystems supports customers across package and process development, prototyping, qualification, and manufacturing for high-reliability semiconductor applications.

"The development of high-frequency semiconductor packaging within India highlights the gradual deepening of our domestic electronics manufacturing ecosystem. As national policies like Semicon 2.0 prioritize advanced packaging and ATMP capabilities, domestic companies that successfully move from design to commercial production in specialized sectors like defence electronics are well-positioned to capture long-term strategic value and build supply chain resilience." — Dr. Shishir Gupta, Founder & CEO, StartupLanes